Analytical Techniques

Overview

Today's semiconductors and electronic devices are in a constant state of evolution. With this evolution comes ever increasing complexity in both manufacturing and analysis. To address this reality IAL maintains a comprehensive set of analytical tools and techniques both in-house at our facility and through a network of highly qualified partner labs. 

Our Capabilities

Initial inspections often utilize a number of non-destructive techniques including:

  • X-ray Inspection, 2-D Real-Time and 3-D*
  • Scanning Acoustic Microscopy or SAM (including c-mode scanning)
  • Optical Inspection (Dark Field, Bright Field, Polarized, High Resolution Mosaic Funtionality)
  • Electrical Test Equipment 
  • Infrared (IR) Microscopy
  • X-ray Fluorescence (XRF) 
  • Fourier Transform Infrared (FTIR) 
  • Energy Dispersive Spectroscopy (EDS) 
  • Hi-pot and Insulation Resistance Testing

Deep dive failure analysis requires a variety of more invasive or destructive techniques, including:

  • Cross Sectioning of ICs and PCBs (Mechanical and FIB)
  • FIB Editing*
  • Scanning Electron Microscopy (SEM and FE-SEM)
  • IC Deprocessing, including:
    • Parallel Lapping
    • Dry and Wet Etching
    • Reactive Ion Etching
  • STEM Prep and Imaging
  • Dye and Pry (BGA devices)
  • Decapping and depotting (ICs)
  • Solderability Analysis 

For fault isolation IAL relies on a variety of techniques, including:

  • Photo Emission Microscopy (PEM)
  • Liquid Crystal Analysis
  • LIVA/TIVA Analysis 
  • Thermal Imaging
  • Electrical Probing 

*Contact for Specific Capabilities

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